Specifications
Mfr Part Number: AS5-3.5G
Features:
Contains 99.9% pure silver
High-Density(contains over 88% thermally conductive filler by weight)
Controlled Tripple-Phase Viscosity
Not Electrically Conductive and Absolute Stability (will not separate, run, migrate, or bleed)
Thermal Conductance: >300,000W/m2 °C (0.001 inch layer)
Thermal Resistance: <0.0045°C-in2/Watt (0.001 inch layer)
Average Particle Size: <0.49 microns <0.000020 inch
Extended Temperature Limits: Peak: -50°C to >180°C Long-Term: -50°C to 130°C
Performance: 3 to 12 degrees centigrade lower CPU

 full load core temperatures than standard thermal compounds

 or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core