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Mfr Part Number: AS5-12G
Features:
Contains 99.9% pure silver
High-Density(contains over 88% thermally
conductive filler by weight)
Controlled Tripple-Phase Viscosity
Not Electrically Conductive and Absolute Stability
(will not separate, run, migrate, or bleed)
Thermal Conductance: >300,000W/m2 °C (0.001 inch layer)
Thermal Resistance:
<0.0045°C-in2/Watt (0.001 inch layer)
Average Particle Size: <0.49 microns <0.000020 inch
Extended Temperature
Limits: Peak: -50°C to >180°C Long-Term: -50°C to 130°C
Performance: 3 to 12 degrees centigrade lower CPU full load
core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in
the CPU core
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